This talk presents the design considerations and implementation of power amplifiers targeting FR3 extreme massive MIMO base-station applications. A comprehensive review of specifications and key chall...
This talk presents several practical and theoretical approaches for the design of wideband, high-efficiency power amplifiers in integrated technologies. The materials will focus on the matching networ...
The introduction of the Load Modulated Balanced Amplifier (LMBA) 10 years ago has opened a whole new track of research in power amplifier architectures, thanks to the flexibility of the concept and th...
GaAs HBTs are the primary workhorses for power amplifiers in sub-6GHz handsets and access points, offering a combination of high power, high PAE, linearity and good price point. They are in a strong p...
This talk focuses on practical FR3 PA design and implementation choices across both silicon and III-V technologies, using a cross-technology lens to clarify where each platform excels and how these tr...
This talk presents next-generation supply modulation technologies for 6G RF power amplifiers, including various approaches such as analog envelope tracking, digital envelope tracking, symbol power tra...
Together with both the development of GaN technologies and the evolution of Doherty PA, high-efficiency GaN PA architectures have advanced to meet ever-increasing system level requirements. Here, for ...
This talk presents a computationally efficient multi-physical modeling framework suitable for integrated-circuit transmitters, enabling joint analysis of power-amplifier behavior, antenna interactions...
This talk introduces IMEC’s 300mm RF Silicon Interposer packaging technology. Key technology modules of this approach will be introduced and the relation to different application requirements will be ...
Heterogeneous integration involves the combination of diverse Integrated Circuit (IC) technologies to enhance system performance while minimizing overall cost. The high-frequency and wide-bandwidth de...