This talk presents a computationally efficient multi-physical modeling framework suitable for integrated-circuit transmitters, enabling joint analysis of power-amplifier behavior, antenna interactions...
This talk introduces IMEC’s 300mm RF Silicon Interposer packaging technology. Key technology modules of this approach will be introduced and the relation to different application requirements will be ...
Heterogeneous integration involves the combination of diverse Integrated Circuit (IC) technologies to enhance system performance while minimizing overall cost. The high-frequency and wide-bandwidth de...
3D Heterogeneous Integration (3DHI) promises scaling improvements and increased system integration and density while allowing for the use of best-in-class technologies that cannot be achieved using mo...
3D heterogeneous integration (3DHI) is critical for the future of mm-wave and RF systems. The ability to integrate various technology nodes into a single package allows for added functionality and imp...
mm-Wave and THz circuit technologies are advancing rapidly to meet the growing demand for high-speed, high-capacity, and long-distance wireless communication. Two major directions are driving this pro...
Sensor applications are emerging in the mm-wave up to sub-THz frequencies, especially in the D- and J-bands, where the challenging system requirements can be met by heterogeneous integration of differ...
This talk reviews key enabling technologies for high-performance mm-wave 3D heterogeneously integrated (3DHI) phased arrays, from device to package. Northrop Grumman’s 90nm gallium nitride node (GaN09...
In advanced packaging technologies, RF launcher design plays a critical role in enabling high-performance signal transitions between the Integrated Circuit (IC) and the package across a broad frequenc...
This presentation describes the design and integration considerations for a scalable 24–30GHz 256-element phased array antenna module composed of four 64-element tiles. The module utilizes a heterogen...