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The presentation will explore different digital linearization strategies for achieving high efficiency in LMBAs when handling 5G NR signals, which feature bandwidths in the hundreds of MHz and peak-to...
This presentation will describe the design of MMIC LMBAs in various GaN technologies and targeting different frequency ranges from X to Ka-band. The design space specific to MMIC implementations will ...
This talk will explore the fundamentals of signal integrity (SI) in high-speed applications, focusing on frequency and time-domain analysis. Attendees will gain a foundational understanding of how sig...
Newer SerDes protocols like PCIe Gen6, USB4, and 100G per-lane Ethernet standards present growing challenges for PCB designers. Data-rates nearly double with each generation, yet circuit board materia...
High-performance AI clusters are increasingly bottlenecked by the energy and communications costs of interconnecting numerous compute and memory resources. Current systems face a gap of nearly two ord...
Rigid-flex PCBs combine rigid boards and flexible circuits, enabling complex designs with high component density and improved reliability, while maintaining strong signal integrity (SI). They offer be...
The rapid increase in internet traffic has driven innovation in high-speed links for data centers. As data rates rise, channel loss leads to Inter-Symbol Interference (ISI), requiring spectrally effic...
Delivering thousands of amps to next-gen high-speed digital designs is a critical challenge for AI chips, multi-die packages, and cloud servers. This talk will explore Power Integrity (PI) digital twi...
Successful employment of GaN HEMT technology in industrial sectors requires an in-depth analysis of their reliability. Therefore, it is of utmost importance to understand the parasitic effects of thes...
The GaN high electron mobility transistor (HEMT) technology continues its expansion across the wireless communication industry, owing to its exciting capabilities in terms of power density, thermal ma...