This work presents a fully-integrated 241–306 GHz coherent radiator for the 300 GHz band. Integrated with an on-chip dipole antenna, the proposed radiator utilizes a frequency multiply-by-24 chain (FM...
This paper presents an ultra-wideband integrated phased-array beamformer chip integrating 4 transmit/receive (TRX) channels in 65-nm CMOS process. Each channel features 16.2 dB TX gain over a 12:1 3-d...
Conventional fully-connected multi-beam phased arrays (FC-MBPA) face severe integration challenges due to complex beam-combining networks (BCN), leading to high complexity and over 10 PCB metal layers...
This paper presents a scalable and compact 28-GHz 4-element 4-stream CMOS fully-connected receiver designed for multi-beam multiple-input multiple-output (MB-MIMO) operation, where high beam-to-beam (...
In this paper, we propose a millimeter-wave relay system powered entirely by energy harvested by wireless power transfer (WPT), eliminating the need for TDD synchronization. The relay transceiver uses...
This paper presents a W-band frequency-modulated continuous wave (FMCW) radar transceiver designed for centimeter-level imaging applications. The transceiver features a self-calibrated Type-III all-di...
We present a linear single-ended distributed driver implemented in 130nm BiCMOS process with fT / fmax of 470/650 GHz, designed for single-ended push-pull thin-film lithium niobate (TFLN) traveling-wa...
This paper presents a 200-Gb/s low-noise transimpedance amplifier (TIA) implemented in standard 28-nm CMOS technology, addressing the escalating bandwidth demands of artificial intelligence data cente...
A 4×212 Gbps, 3.34 pJ/bit PAM-4 optical transmitter chipset for Linear Pluggable Optics (LPO) applications is presented, featuring a co-designed architecture with a 57 GHz E/O bandwidth and a 20 dB ga...
We present a photoreceiver assembly optimized through comprehensive modeling of the photodiode (PD), the transimpedance amplifier (TIA), and their interconnection. This allows an early and accurate op...