Panel Sessions

Augmented-reality contact lenses, cochlear implants, AI-aided earbuds, and thought-activated prosthetics have already demonstrated the restoration and enhancement of human capabilities, and the incorporation of artificial intelligence (AI) into these technologies can further increase their potential.

This lunchtime panel will host academia researchers and industry pioneers who are developing these technologies and will debate how they will affect our near- and long-term lifestyles.

In all lunchtime panel sessions the audience will be able to submit questions and be polled via Slido.com. You may also submit questions ahead of time for a particular session by using the code that is associated with that session.

The Sli.do code for this session is: #2728204

The use of machine learning (ML), or more broadly, artificial intelligence (AI), has already been demonstrated in a wide range of applications, including even music composition and artistic design.

This lunchtime panel, with both industry and academia experts, will explore how we may harness AI in wireless system design and operation, and will attempt to distinguish hope from hype.

In all lunchtime panel sessions the audience will be able to submit questions and be polled via Slido.com. You may also submit questions ahead of time for a particular session by using the code that is associated with that session.

The Sli.do code for this session is: #2902242

The technical publications environment is currently undergoing an enormous upheaval. The tried-and-true subscription journals, which have been the backbone of scientific dissemination for more than three hundred years, are rapidly being challenged by all digital pay-to-publish venues from both reputable, and not so reputable, for-profit enterprises. The number of new journals entering the marketplace is increasing at an exponential rate. Within the MTT-S, we have more than doubled the number of publications within the last ten years, and authors, readers, and technical experts are being overwhelmed both with content choice and demands on peer reviewing. This special rump session, which will be moderated by Dr. Peter Siegel and Dr. Ke Wu, will focus on the growing concerns of our author and end-user communities regarding the future of scientific publishing and the position that IEEE, and specifically MTT-S, should take in moving forward. The session will also focus on the editorial content and practices of our core publications, including manuscript preparation, the peer review process, quality standards, industrial contributions, and editorial practices. We will bring together Editors-in-Chief and/or Editorial Board members from several of our core publications and young professionals to present their perspectives and experiences on publication policies and practices.

Even as today’s sophisticated electronic systems have evolved, the designs behind them have remain largely in multiple silos: digital, analog, RF, package, board, analysis, and more. These disjointed flows involving multiple tools cause delays and design risks. How can these silos be broken down and design-led with integration and optimization at the electronic system level?

Model-based systems engineering (MBSE) is a methodology where a set of models are developed for use in the design, analysis, and verification of complex systems. MBSE is having a renaissance, expanding beyond high level requirements capture and system modeling to incorporate detailed, higher fidelity and physics-based modeling techniques. This is already moving forward in major aerospace / defense companies, but also appearing at commercial companies in the space and wireless arenas. But will these advances truly bring us digital twins of our systems and products, or will we fall back to our old ways of siloed design and ‘over the wall’ information sharing?

Join us for a discussion by experts in MBSE practices, leaders in industry and academia, and EDA specialists to explore whether MBSE really is the gateway to digital twinning or is the challenge too big to overcome on the path to success?

In all lunchtime panel sessions the audience will be able to submit questions and be polled via Slido.com. You may also submit questions ahead of time for a particular session by using the code that is associated with that session.

The Sli.do code for this session is: #2498906

RF/microwave Front-End Modules (FEM) including antenna systems operating over MHz-through-THz frequency range for sub-7 GHz and 5G/6G applications, continuously require innovative solutions for meeting high electrical, RF, mechanical, and thermal performance at a low cost. This MTT-S Inter-Society Technology Panel (ISTP) will discuss recent advancements in RF/microwave packaging and interconnect technologies enabled by emerging new materials, advanced processing techniques and topological innovations as well as underlying technical challenges. This special panel will bring together industrial and academic experts of various background from different IEEE societies and other organizations, including IEEE MTT-S, EPS, AP-S, SSCS, EMC-S, CASS, and others. While the state-of-the-art achievements in manufacturing, interconnect, and packaging techniques will be reviewed, this panel will debate the critical issues and the relative advantages and suitability of various emerging materials and interconnects (hybrid/metaconductors); processes such as additive and subtractive manufacturing; matured and emerging integration techniques - MCM, AiP/SoC/SiP/SoS, heterogenous and wafer-level packaging and chiplets; considering cost, performance, reliability/repeatability and volume production requirements; and will suggest possible application spaces with time scales and future directions. The panel will also discuss the impact of new technologies on the traditional realm of metal conductors and subtractive manufacturing.

In all lunchtime panel sessions the audience will be able to submit questions and be polled via Slido.com. You may also submit questions ahead of time for a particular session by using the code that is associated with that session.

The Sli.do code for this session is: #3882939

Recently industry of Wireless Power Transfer (WPT), which involves near-field WPT and far-field WPT, has risen significantly. For near-field transfer, we can already buy wireless chargers everywhere and cheaply for smartphones. Startup companies are developing far-field WPT for IoT sensors based on new radio regulations. In THE ITU-R, enthusiastic discussions for new radio regulation of the WPT and safety concerns are taking place every year. WPT is expected as one of the game-changing technologies with electromagnetic waves/fields. Although since 1960s the theory has been established and advanced with a long history, the expectation for WPT market and industry seems to be higher than the reality. The high-power wireless chargers for electric vehicles and battery-less IoT sensors powered by microwaves have not appeared in the mass-production markets. What will be the industrial future of the WPT? What are the innovative technologies needed to create wide-use markets? How do we harmonize the WPT with conventional radio applications? How do we create human safe WPT system? Can we have worldwide universal standards? In this panel, panelists from the WPT and application industries, power electronics society, and antenna propagation society will discuss these important topics from diverse and cross-disciplinarity perspectives.

In all lunchtime panel sessions the audience will be able to submit questions and be polled via Slido.com. You may also submit questions ahead of time for a particular session by using the code that is associated with that session.

The Sli.do code for this session is: #1377373

The chip and system level coexistence of FR1 (sub-6 GHz) and FR2 (mmWave) wireless standards, including 5G and beyond, is highly debated because of both capital and operational expenditures. On the other hand, these bands are utilized to offer uninterrupted connectivity for relevant time-critical applications that demand Ultra Reliable Low Latency Communications (URLLC). These include for example telesurgery, remote diagnostics, remote monitoring of health conditions of patients and elderlies, virtual clinics, etc. Many of the sensors involved in these applications, such as that used for remotely monitoring vital parameters of patients and elderlies (remote measurement of blood-pressure, blood-sugar, sudden falling, etc.), and communicating their measurements wirelessly, need such a coexistence for a reliable operation.

It is the aim of this Panel to present the relevant healthcare applications that rely on the wireless communications offered by 5G and beyond, and to discuss their need for eventual FR1-FR2-coexistence on both chip- and system-levels.

In all lunchtime panel sessions the audience will be able to submit questions and be polled via Slido.com. You may also submit questions ahead of time for a particular session by using the code that is associated with that session.

The Sli.do code for this session is: #1186158