Microwave Week 2020 Dashboard

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We2H-2: A High-Efficiency GaAs HBT Power Amplifier for 6G FR3 Applications
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We3B-3: A 71-to-76GHz 8-Element Switchless Isolated Spectrum Phased-Array Transceiver with Direct-Modulation and Reflectionless Sliding-IF
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We3B-6: A 71–76GHz Four-Element Phased-Array Receiver with Compact Footprint in 65-nm CMOS
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We3C-5: An Ultra-Compact D-Band SIW Filter with Multifunction Transitions to Coplanar Input/Output
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We3G-1: A 7.8–11.9GHz Quad-Mode Class-F2,3 VCO with Multi-Stage Cross-Shared Common-Mode Path Achieving -131.9dBc/Hz 1-MHz Phase Noise and 201.8dBc/Hz FoMT
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We3H-2: A Broadband Doherty-like Load-Modulated Balanced Amplifier with an Optimized Impedance Transformation Ratio in InGaP/GaAs HBT Process for Handset applications
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IF1-3: Dielectric Filled Waveguide Antenna for Air-Borne Application
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IF1-9: Electromagnetically Induced Transparency Based Metamaterials Integrated with Plasma Cells for High Power Microwave Protection
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IF1-16: RPRS: Real-Time Privacy mm-Wave Radar Sensing System
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IF1-20: A THz Attenuator Based on Voltage-Tunable Whispering Gallery Mode Resonator
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IF1-27: Quantum Method for Solving S-Parameters of Lossless Waveguides Based on the HHL Method and Finite-Element-Method
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IF1-32: S-Parameter-Based Simulation Technique and Crosstalk Suppression for Large-Scale Superconducting Quantum-Computing Chip Design
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IF1-36: Multi-Functional Modulated Surface Based on M-Type Ferrite for mmWave Application
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IF1-43: A Compact Brick-Type 40GHz-Band DBF Transmit Antenna Module Using Direct Digital RF Technology
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Th1A-1: A D-Band Tx FOWLP Module with Silicon-Based Resonator Antenna Array
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Th1A-4: A Wideband W-Band Slotted Over-Mode Cavity Array with Dumbbell-Shaped Holey-EBG Units Based on Metallic Silicon-Based Process
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Th1C-1: Innovative Hybrid Stripline Guiding Structure for Wideband Crossover Implementation
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Th1D-3: Temperature and Humidity Effects on Electromagnetic Waves Utilizing 140GHz Radar Measurements
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Th1F-2: E-Band Power Amplifier with 32.2dBm Psat, 31.3dBm OP1dB Utilizing Commercial 0.10-µm GaAs pHEMT Technology
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Th1G-3: A 132GHz SiGe BiCMOS Sampler for Linear Front-Ends
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Th2A-1: Novel Low-Loss Shielded Interconnects for D-band/sub-THz Applications Using Microscale Metal Printing Technologies
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Th2B-2: Low-Loss Longitudinal Leaky SAW Filter with 1350MHz Bandwidth on LiNbO₃/SiO₂/SiC Platform for Wi-Fi 7
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Th2C-1: A Reconfigurable Filtering Circulator/Isolator with Continuously Controllable Center Frequency and Insertion Phase
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Th2D-2: Millimeter-Wave Wideband Active Load-Pull System Using Vector Network Analyzer Frequency Extenders
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Th2F-2: 300-GHz-Band InP HBT Power Amplifier Module Enabling 280-Gbps 0-dBm Signal Generation with Digital Predistortion
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Th2G-2: A 130GHz 360° Gain-Invariant Phase Shifter with 5.625° Phase Resolution, 0.19° RMS Phase Error and < 0.56dB RMS Gain Error
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Th2G-6: First Demonstration of MMIC Low-Noise Amplifiers Operating at Ka-Band Realized with Enhancement-Mode Gallium Nitride HEMTs
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Th3A-5: Integration of Millimeter-Wave Air Filled Cavities and Filters Using Vertically Aligned Carbon Nanotubes
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Th3B-3: AlN/GaN MIS-HEMT With GeN Gate Dielectric for mm-Wave Applications
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Th3C-2: Tunable Dual-Band Coaxial Filter with Independent Band Control Using a Single Tuning Element Per Band
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Th3D-3: Characterization Approaches to Reduce Process Variation Dependencies for On-Wafer Power Calibration Transfer Devices in Bi/CMOS Technologies
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Th3F-3: AI-Assisted Template-Seeded Pixelated Design for Multi-Metal-Layer High-Coupling EM Structures: A Ku-Band 6G FR3 PA in 22nm FDX+
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Th3G-2: An 8–12.2GHz CMOS Low-Noise Amplifier with Partially Tail-Coupled Transformer and Large-Transistor Achieving 1.8dB Average NF
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WSG-1: Ku- and Ka-Band Beamformer with Antenna Arrays
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WSM-4: Will Light Communication be the coming 6G?
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WSL-2: 100–300GHz Power Amplifiers: Transistor Limits, Circuit Topologies
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WSA-4: Calibration-Free DSM Noise Suppression in Analog Frequency Synthesizers
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WSO-4: Design, Modeling and Control of Spin Silicon Qubits: from Confinement to Characterization
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WSJ-6: How to Ensure Flexible and Efficient Use of Spectrum, from Advanced 5G Doherty Power Amplifiers to Digitally Assisted Wideband PA for 6G BTS
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WSC-3: AI/ML Techniques Supporting the Design Automation of RF/mm-Wave Devices and Circuits
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WSK-4: THz Electronics for Sensing and Communication Applications
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WSQ-3: What AI Algorithms Can Do, and What They Can’t
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WMI-5: Solution of Sparse Matrix Equations Using HHL Algorithm with Quantum Walk Unitary Operator
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WME-7: Advanced Modeling and Synthesis of Consolidated Additively Manufactured Waveguide Filter Assemblies
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WML-3: Fundamentals of FDTD
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WMK-2: AlN Crystal Growth and Related Power Devices — Status and Further Path in Germany
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WMB-3: Cryogenic On-Wafer Noise Measurements Using a Cold-Attenuator Method
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WMM-9: Reciprocal Full-Duplex FMCW Radar Systems with Self-Interference Cancellation for High Accuracy Distributed Radar Networks
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WMA-4: Amplifiers with Multifunctionality and Integration on Internally Matched Wafer-Level-Package Using Silicon Interposer Technology
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WMH-7: Liquid Metal (LM) Enabled Microwave and mm-Wave Devices
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Microwave Week 2020 Dashboard

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