Microwave Week 2020 Dashboard

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Displaying 851 - 900 of 2759

WSH-6: Development of Co-Packaged Optics Technology for Photonics Applications
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WSL-8: Stacked-FET CMOS Power Amplifier for mm-Wave and Sub-THz Applications
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WSI-8: Integrated Self-Interference Cancelers for Fully-Duplex Radios
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WSJ-4: Load-Modulated PA Architecture Comparison Using Non-Linear Embedding
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WSF-7: Mixed-Signal RFIC in SiGe:C BiCMOS for mm-Wave Antenna-in-Package and Antenna-in-Module Solutions
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WSK-1: THz Integrated Circuits Beyond 500GHz: Challenges and Opportunities
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WSP-4: Advanced RFIC Techniques using Non-Uniform Sampling and Time-Approximation Filters
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AIB1-4: Augmented Intelligence for End-to-End Design
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WME-1: Emerging MHz-Through-THz Structures and Techniques that Challenge the Electromagnetic Modeling and Simulation Community
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WMG-8: A GaN Technology to Meet Future Radio Requirements
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WMD-3: Quantum Control of Bulk Acoustic Phonons
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WMK-7: Diamond Electronics: Current Status and Path Forward
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WMM-8: Gallium Nitride: A Promising Technology for Fully Integrated Transceiver Front-End
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WMF-8: Approaches to Carry Out Well-Documented Measurements for Active Devices Using Varying Calibration Methodologies
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WMH-1: Silicon Micro-Machined Liquid Crystal Tunable Microwave and mm-Wave Devices
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WMN-8: Electromagnetic Modeling and Simulation Challenges for Silicon Interposers in 2.5D/3D IC Chip Design
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WMO-8: In-Cabin Radar Sensing
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WMR-1: LMBA Basics
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WMQ-3: Advanced GaN HEMT Characterization and Modeling Techniques
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Tu1A-3: An 120GHz 8×8 FMCW MIMO Radar System With 90° Biaxial FOV for Autonomous Navigation of UAVs in 3-D Space
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Tu1B-2: A V-Band OOK Transmitter with 14.5Gbps Data Rate and 11.1% DC-to-RF Efficiency in 65nm CMOS
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Tu1C-3: Multi-Channel Integrated Microwave Photonic Transmitter for Radio-over-Fiber Systems
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Tu1E-1: A Cryogenic Front-End Module Applied to Readout Two-Qubits with FDM Technology in Superconducting Quantum Computing System
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Tu1E-5: A Demonstration of Multi-Floating Superconducting Qubits on a 3D Flip-Chip Platform with TLS Loss Mitigation via Apertures
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Tu2A-1: Frequency-Spatial Adaptive Digital Beamforming Technique for Range-Angle Decoupling With High-Resolution MIMO Radar
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Tu2B-4: Enhanced Channel Capacity Underwater Multi-Diver Communication with Dual-Resonant Magnetoquasistatic Coupling
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Tu2C-4: High Sensitivity W-Band LEKID-Based On-Chip Polarimeter
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Tu2D-4: 10 Watt CW Power Handling SPDT RF Switch Using E-Mode p-GaN Dual-Gate HEMT Technology
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Tu2E-4: Recurrent Neural Network Modeling of Radio Frequency Amplifiers for System-Level Simulation and Design
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Tu2F-3: 1.9GHz–4.1GHz CMOS Rectifier with Over 48% Efficiency Using Inductive Feedback and CRT Reduction for Beamforming WPT
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Tu3A-4: A 0.3dB-NF SiGe LNA Array for 10.5T Multi-Channel MRI Receivers
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Tu3B-1: 150GHz-Band Compact Phased-Array AiP Module for XR Applications toward 6G
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Tu3B-4: Body Proximity Detection Based on Reflections of Multi-Antenna Uplink Transmission from a 5G Mobile Handset
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Tu3D-3: A 280GHz Sub-Harmonic Injection Locked Oscillator in 45nm CMOS PD SOI
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Tu3E-5: A High-Linearity Quasi-Darlington Amplifier with Sub-Degree AM-PM for WLAN Applications
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Tu4A-1: Through-the-Wall Concurrent Vital Signs Monitoring of Three Subjects Using Single-Channel CW Radar and Independent Component Analysis
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Tu4B-2: A 2:1 Bandwidth 3–6GHz Dual-Polarized True-Time-Delay Based Reconfigurable Intelligent Surface (RIS)
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Tu4C-2: Planar Low-Loss Ultra-Wideband Coaxial-Less Balun and 4-Way Combiner for High-Power Applications
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Tu4D-1: Ultrawideband Vector Modulators for Next-Gen Wireless Networks in the 200–480GHz Range
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Tu4E-5: Neural Network Based Nonlinear Forward Model Identification for Digital MIMO Arrays Under Load Modulation
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Tu4F-5: An Interleaved 1×8 Dual-Polarized L-band Phased Array with Digital Transmit/Receive Beamforming Using RFSoC
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We1B-6: A 10-GHz Localized-LO-Phase-Shifting Phased-Array Transmitter
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We1D-3: Towards Tensor-Train Solution of Vector Volume Integral Equation in 3D with log-N Complexity
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We1E-4: Coupling Matrix Reconfiguration Aided with a Start System Based on Simultaneous Diagonalization
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We1G-5: A DC-to-170GHz Direct-Coupled Mixer Achieving 47dB LO-RF Isolation in 250nm InP DHBT Technology
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We1H-5: An X-Band Low-Voltage GaN HEMT Stacked Power Amplifier Operating in Class-J with Active Second Harmonic Injection
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We2B-4: A 16.2-to-22.2-GHz Phased-Array Receiver with -60-to-85°C Simultaneously Gain and NF Temperature Compensation Supporting 24Gb/s 64QAM Modulation
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We2C-4: Extraction of Coupling Matrix for Bandpass Filters Based on Magnitude of S-Parameters
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We2E-1: 50-Way W-Band All Waveguide Radial Combiner Design
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We2G-3: A D-Band ×15 Frequency Multiplier Chain in 45nm SiGe BiCMOS for Board-Level Packaged Array Applications
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Microwave Week 2020 Dashboard

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