Microwave Week 2020 Dashboard

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Displaying 51 - 100 of 2759

IF1-46: Extended D-Band Low-Noise-Amplifier MMICs Based on a 50-nm Metamorphic HEMT Technology
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Th1A-3: Evaluation of Stacked Structure for 160GHz End-Fire Type Compact Antenna-in-Package Considering Thermal Design
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Th1B-2: A Low-Loss, Wideband, 0–110GHz SPDT Using PCM RF Switches with Integrated CMOS Drivers
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Th1C-4: Twisted-Shaped Millimeter-Wave Hybrid Couplers in 150nm GaN Technology for 5G Applications
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Th1D-5: A Novel Q-Choked Sapphire Sandwiched Resonator for Wide-Band Measurements of Flat Dielectric Samples
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Th1G-2: DC-to-89-GHz AMUX-based IQ Modulator in 250-nm InP HBT Technology for Multiplexing-DAC Subsystem
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Th1G-5: A 0.9pJ/Bit 56Gb/s High-Swing Tri-Mode Wireline Transmitter with 6-Bit DAC Controlled Tailless-CML Driver and Impedance Calibration Loop
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Th2A-4: First Demonstration of Highly Scaled RF GaN-on-Si Dielets Embedded in Glass Interposer
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Th2B-4: Miniature High-Coupling Lithium Niobate Thin Film Bulk Acoustic Wave Resonators at 10–30GHz
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Th2C-4: Enhanced Performance of Continuously Variable Phase Shifters Using Liquid Crystals in Corrugated Oversized Substrate Integrated Waveguides
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Th2D-4: Cross-Spectrum Phase Noise Measurements of 10-15-Level Stability Photonic Microwave Oscillators
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Th2F-5: A Broadband InP Darlington Amplifier with Two-Way Distributed Power Combining
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Th2G-5: A 6.5-GHz Low-Power Self-Interference Cancellation Receiver with Two-Stage Feedforward Technique and Automatic Gain Control Loop
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Th3A-2: A Reconfigurable Dielectric-Loaded Millimeter-Wave Waveguide Bandpass Filter Based on Customized 3D-Printing Vanadium Dioxide Filament
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Th3B-1: Deep Level Effects and Hot-Electron Reliability in Scaled GaN HEMTs
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Th3B-4: Influence of Double-Deck T-Gate Structures on Cut-Off Frequency in Al0.3Ga0.7N/AlN/GaN HEMTs
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Th3C-5: An Electrical Balance Duplexer Architecture without Inherent Insertion Loss Limitation
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Th3D-5: Cryogenic Microwave Probe Technology with High Thermal Insulation
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Th3F-5: On-Board Array Self-Calibration Using Amplitude-Only Proximal-Field Sensors and Machine-Learning-Based Phase Retrieval
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Th3G-5: A 50–70.9-GHz LNA with Defectly-Coupled-Transformer Achieving Sub-4 dB NF and 298.6-GHz GBW for 5GNR-FR2-2 and SATCOM
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WSD-5: Potential of event-driven continuous-time digital signal processing for ultra-low-power applications
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WSG-7: SiGe LNA for SATCOM
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WSH-4: Bits to Beams: How do You Simulate a Heterogeneously Packaged, Digitally Steered Phased Array?
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WSL-7: Sub-THz SiGe HBT Cascode Power Amplifiers with Capacitive Feedback and its Use in a Supply Modulated RF Transmitter Front-End
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WSI-6: Antenna Interfaces with Built-In Self-Interference Cancellation for Future Communication and Sensing Systems
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WSN-2: RF Hardware for Large-Scale Superconducting Quantum Computing
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WSF-2: mm-Wave and Sub-THz CMOS Front-Ends for 6G
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WSB-1: Integrating Sensing Functionality in Mobile Communication Networks
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WSK-7: Trends in mm-Wave and THz Test Equipment
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WSQ-6: Multi-Objective Visualization for Power Amplifier Design
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WMI-7: Deep Microscopic Quantum Solvers for Spin Qubits Coupled to Complex Electromagnetic Environments
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WMG-2: Challenges and Solutions of Epitaxy by MOCVD for RF GaN/Si
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WML-6: Computational Electromagnetics and Material Characterization: Some Meeting Points of the Two Worlds
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WMK-3: The Role and Challenges of Ultra-Wide Bandgap Semiconductors in Next-Generation GaN HEMTs
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WMM-3: CMOS Simultaneous Transmit and Receive (STAR) Front-Ends for Dual-Use Commercial and Defense Applications
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WMF-1: On-Wafer Calibrations and Material Measurements
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WMJ-7: Sustainable Materials-Enabled Microwave Sensors: Are We Considering Manufacturing?
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WMN-7: Multilayered Wearable Ultrasound Technology
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WMO-7: Understanding the Nuances of Being Human: Implications for Radar-Based Human Motion Classification
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RFB1-7: Tx/Rx Communications System Digital-to-RF Design and Test
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WMQ-2: Characterizing Low-Frequency Memory Effects using RF Real-Time NVNA Measurements
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Tu1A-3: An 120GHz 8×8 FMCW MIMO Radar System With 90° Biaxial FOV for Autonomous Navigation of UAVs in 3-D Space
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Tu1B-2: A V-Band OOK Transmitter with 14.5Gbps Data Rate and 11.1% DC-to-RF Efficiency in 65nm CMOS
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Tu1C-3: Multi-Channel Integrated Microwave Photonic Transmitter for Radio-over-Fiber Systems
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Tu1D-4: A 400W Symmetric Doherty Power Amplifier Covering 1.8–2.7GHz
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Tu1E-5: A Demonstration of Multi-Floating Superconducting Qubits on a 3D Flip-Chip Platform with TLS Loss Mitigation via Apertures
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Tu1F-5: Overcoming Efficiency Degradation in Wireless Power Transfer Systems: A Supply Voltage Modulation Method Empowered by 5.64-GHz 256-Element Antenna Array Receiving 10.6-Watt
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Tu2B-3: Body-Resonance Human Body Powering
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Tu2C-4: High Sensitivity W-Band LEKID-Based On-Chip Polarimeter
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Tu2D-3: System-in-Package Doherty Power Amplifier Using Hybrid LDMOS/GaN Line-Up for 5G Macro Driver Applications
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Microwave Week 2020 Dashboard

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