Microwave Week 2020 Dashboard

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IF1-6: USB Type-C Receptacle Connector with Ceramic Insulator and Three-Layer Ground Plates
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IF1-12: Detection Algorithm for Waveguide Connection and Probe Contact States Based on Machine Learning in Frequency up to 1.1THz
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IF1-18: A High-Efficiency Outphasing Power Amplifier Utilizing a Synthesized Direct-Matching Technique Based on Two-Section Branch-Line Coupler Output Combiner
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IF1-22: Ultra-Wideband 6-Bit Passive Phase Shifter with Open-Circuit Microstrip Pseudo-π Network and Low RMS Phase Error
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IF1-28: High Power-Added-Efficiency AlGaN/GaN E-Mode HEMTs for Low-Supply-Voltage RF Terminal Applications
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IF1-33: High-Efficiency Low-Complexity ASK Transmitter Using an Inverse Class-F Power Amplifier with a Nonuniform Transmission-Line-Based Load Transformation Network
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IF1-39: Predicting the Fidelity of Multiplexed Superconducting Qubit Readout with Multiphysics Numerical Methods
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IF1-45: Direction Finding for Software Defined Radios with Switched Uniform Circular Arrays
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Th1A-3: Evaluation of Stacked Structure for 160GHz End-Fire Type Compact Antenna-in-Package Considering Thermal Design
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Th1B-2: A Low-Loss, Wideband, 0–110GHz SPDT Using PCM RF Switches with Integrated CMOS Drivers
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Th1C-3: Ka-Band AFSIW Circuit-on-Substrate for Satellite Applications
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Th1D-4: Dielectric Measurements of Conventional and 3-D Printed Substrate Materials from 50GHz to 1.5THz Using Free-Space and TDS Methods
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Th1F-4: A 16-Way 115–129GHz High Power Amplifier with 20.9dBm PSAT and 17.6dBm P1dB in 40nm Bulk CMOS
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Th1G-4: A >22GS/s, 44dB SNDR Wideband 4×4 Time-Interleaved Sampling Front-End with Bulk-Driven Mismatch Calibration in 22nm FDSOI
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Th2A-3: High Performance Waveguide Launcher in Interposer Package Technology for 77/79GHz Automotive 4D Imaging Radar
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Th2B-3: Frequency and Bandwidth Design of Millimeter Wave Thin-Film Lithium Niobate Acoustic Filters
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Th2C-3: Novel Reflective-Type Bandpass Filter with Simultaneously Integrated Tunable Attenuation and Phase Shifting Functions
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Th2D-3: A Wideband Digital Compensation Model Based on Fast Bandwidth Sensing for Zero-IF Receiver
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Th2F-4: 208GHz InP Distributed Amplifier with Combining Loss Reduction Techniques
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Th2G-4: A 71–86-GHz Receiver with 5-GHz IF Signal Bandwidth for E-Band Broadband Communication in 65-nm CMOS
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Th3A-2: A Reconfigurable Dielectric-Loaded Millimeter-Wave Waveguide Bandpass Filter Based on Customized 3D-Printing Vanadium Dioxide Filament
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Th3B-1: Deep Level Effects and Hot-Electron Reliability in Scaled GaN HEMTs
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Th3B-4: Influence of Double-Deck T-Gate Structures on Cut-Off Frequency in Al0.3Ga0.7N/AlN/GaN HEMTs
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Th3C-5: An Electrical Balance Duplexer Architecture without Inherent Insertion Loss Limitation
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Th3D-5: Cryogenic Microwave Probe Technology with High Thermal Insulation
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Th3F-4: Dall-EM: Generative AI with Diffusion Models for New Design Space Discovery and Target-to-Electromagnetic Structure Synthesis
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Th3G-4: A 140 GHz Low-Noise Amplifier in 45 nm RFSOI Based on a Joint-Noise-and-Gain-Optimized Embedding Network
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WSG-2: Multi-Orbit SATCOM Terminals for NTN and the Components that Make These Viable
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WSM-6: Beyond 200Gb/s Driver Design
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WSL-2: 100–300GHz Power Amplifiers: Transistor Limits, Circuit Topologies
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WSA-6: (Voltage-Controlled) Oscillators with Ultra-Low Phase Noise
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WSO-6: SiGe HBT Compact Modeling for Circuit Design at Cryogenic Temperatures
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WSJ-5: Antenna-VSWR-Resilient Load-Modulated Balanced Amplifier (LMBA) for Massive MIMO Communications
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WSF-9: Phased Array in mm-Wave and Sub-THz for Communication and Sensing
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WSK-3: Photonics-Based THz Generation for THz Communication Testing and System-Level Demonstrations
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WSP-5: Next Generation mm-Wave Technology: Beamforming with Joint Phase and Time Array
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WMI-2: Classical Electromagnetic Considerations in Designing Superconducting Qubit Devices
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WME-4: Design Aspects of Waveguide Polarizers and Orthomode Transducers
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WML-1: Fundamentals of Method of Moments
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WMD-6: Design and Fabrication of Phononic Integrated Circuits in Scandium Aluminum Nitride
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WMK-3: The Role and Challenges of Ultra-Wide Bandgap Semiconductors in Next-Generation GaN HEMTs
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WMM-2: Digital Self-Interference Cancellation for Different Modulation Formats
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WMF-1: On-Wafer Calibrations and Material Measurements
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WMJ-1: Lossy Microwave Sensors
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WMN-2: The Role of Advanced Microelectronics and Heterogeneous Integration for Next-Generation 5G/6G Microsystems
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WMO-2: Towards Higher Accuracy in Vital-Sign Detection Using MIMO and Deep Learning
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RFB1-2: Spectral Analysis and Receiver Technology
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WMP-3: Design Challenges and Considerations for Reliable Rigid-Flex PCB up to 100GHz
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Tu1A-2: A D-Band 1Tx 4Rx Mid-Range Automotive CMOS FMCW Radar
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Tu1B-1: Double HOOK: A 140 GHz 15 Gb/s Reconfigurable 3-Level ASK Modulator with Constant Input Impedance for High-Speed Connectivity
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Microwave Week 2020 Dashboard

Technical Session Audience Rating IMS