Microwave Week 2020 Dashboard

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Technical Session Audience Rating IMS

Displaying 1251 - 1300 of 2745
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  • Th2B-3: Frequency and Bandwidth Design of Millimeter Wave Thin-Film Lithium Niobate Acoustic Filters
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  • Th2C-3: Novel Reflective-Type Bandpass Filter with Simultaneously Integrated Tunable Attenuation and Phase Shifting Functions
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  • Th2D-3: A Wideband Digital Compensation Model Based on Fast Bandwidth Sensing for Zero-IF Receiver
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  • Th2F-3: 300GHz 8×1 Active Phased Array MMIC with On-Chip Power Amplifiers, Vector Modulators, and Antennas
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  • Th2G-4: A 71–86-GHz Receiver with 5-GHz IF Signal Bandwidth for E-Band Broadband Communication in 65-nm CMOS
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  • Th3A-2: A Reconfigurable Dielectric-Loaded Millimeter-Wave Waveguide Bandpass Filter Based on Customized 3D-Printing Vanadium Dioxide Filament
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  • Th3B-1: Deep Level Effects and Hot-Electron Reliability in Scaled GaN HEMTs
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  • Th3B-3: AlN/GaN MIS-HEMT With GeN Gate Dielectric for mm-Wave Applications
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  • Th3C-4: Spin Wave Fast Tunable (SWiFT) Filter
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  • Th3D-4: Differential-Mode Characterization of Multi-Port Passives up to 170GHz Using Independent Single-Ended Two-Port Measurements
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  • Th3F-4: Dall-EM: Generative AI with Diffusion Models for New Design Space Discovery and Target-to-Electromagnetic Structure Synthesis
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  • Th3G-3: Broadband LNA with Dual-Resonance Matching Network with Capacitive Feedback for Improved Gain and Noise Figure Using 0.1-µm GaAs pHEMT Technology
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  • WSG-1: Ku- and Ka-Band Beamformer with Antenna Arrays
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  • WSM-5: Future of optical and wireline transceiver
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  • WSL-2: 100–300GHz Power Amplifiers: Transistor Limits, Circuit Topologies
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  • WSA-5: Design of a Low-Jitter Ring-Oscillator-Based Fractional-N Digital PLL
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  • WSO-5: High Throughput Manufacturing and Testing of Semiconductor Spin Qubit Quantum Processors
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  • WSJ-5: Antenna-VSWR-Resilient Load-Modulated Balanced Amplifier (LMBA) for Massive MIMO Communications
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  • WSF-9: Phased Array in mm-Wave and Sub-THz for Communication and Sensing
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  • WSK-2: Substrateless Platform: A Promising Route to THz Integration
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  • WSP-2: Fully Integrated, Time-Varying Non-Reciprocal Components for RF and mm-Wave Systems
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  • WMI-2: Classical Electromagnetic Considerations in Designing Superconducting Qubit Devices
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  • WME-3: Efficient Generation of Exact Filter Models for High-Power Analysis
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  • WMG-10: Reliability Challenges of GaN-on-Si RF Technologies
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  • WMD-5: Manipulating Surface Acoustic Wave Phonons in the Quantum Regime
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  • WMK-9: Thin-Film Diamond Integration for Advanced Thermal Management in Electronics
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  • WMM-8: Gallium Nitride: A Promising Technology for Fully Integrated Transceiver Front-End
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  • WMM-11: Component and System-level Approaches for Analog Interference Mitigation
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  • WMA-6: Diamond-Metal Composite Package for High-Power RF Device
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  • WMN-1: Microwave and mm-Wave Multifunction Filtering Circuits Using Three-Dimensional High-Integration Technology
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  • WMO-1: Workshop Overview
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  • RFB1-1: The RF/Microwave Signal Chain, Network Characteristics, Analysis and Measurement
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  • WMP-2: An Overview of Equalization Techniques for Serial Communication Channels
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  • Tu1A-1: A Fully Integrated Ka-Band FMCW Radar SoC with Baseband Accelerator for Vital Signs Monitoring in 40-nm CMOS
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  • Tu1A-5: Radar-Based Measurement of Image Rejection Ratio in Sub-THz Hartley Receivers with its Impact on Doppler Detection Accuracy
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  • Tu1C-1: Field Trial of a Coastal Surveillance System Exploiting a Multistatic Multiband Photonics-Based Radar in Coherent Sparse MIMO Configuration
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  • Tu1D-2: A 7GHz High Efficiency GaN Doherty Power Amplifier Module for 5G Massive MIMO Base-Stations
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  • Tu1E-3: A Cryogenic Push-Pull Class-C Dual-Mode VCO with 72%-Tuning Range for Quantum Applications
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  • Tu1F-4: Power Receiving Circuit Design of Single-Ended Biological Capacitive WPT for Artificial Retina System
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  • Tu2A-5: Three-Dimensional Fourier Domain Millimeter-Wave Imaging Using Incoherent Active Illumination and Pulse Compression
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  • Tu2C-2: On-Chip Photonic THz Emitter with Integrated InGaAs UTC-PD and 2×2 MPA Array on SiC Substrate
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  • Tu2D-1: RF-Input Doherty-Like Load-Modulated Balanced Amplifier with Decade Bandwidth Enabled by Novel Broadband 180-Degree Power Divider
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  • Tu2E-2: DeltaDPD: Exploiting Dynamic Temporal Sparsity in Recurrent Neural Networks for Energy-Efficient Wideband Digital Predistortion
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  • Tu2E-6: AdaAFE-CIM: A Hardware Implementation of Subspace Tracking for Adaptive Radar Data Compression
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  • Tu2F-5: Compact Design of Highly-Efficient Dual-Band Voltage Doubler Rectifier by Using Second-Harmonics Suppression for Wireless Power Transfer
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  • Tu3B-1: 150GHz-Band Compact Phased-Array AiP Module for XR Applications toward 6G
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  • Tu3B-2: A 28GHz Beamformer Element Demonstration Using Monolithically Integrated GaN and Si Transistors in 300mm GaN-on-Si Technology
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  • Tu3C-4: Predistortion Linearization: Concepts, The State of the Art, and the Future
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  • Tu3E-2: An Integrable Analog Domain Linearization Architecture for the Power Amplifiers in MIMO Systems
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  • Tu3F-4: Differential Frequency Selective Surface Sensor for Polymeric Coating Damage Detection Using Electromagnetically Shielded Reference Resonator
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