Microwave Week 2020 Dashboard

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Displaying 1501 - 1550 of 2745

We3C-2: Miniaturized D-Band SPDT/DPDT Switches Using Series Triple Coupled Transformer Cores in 65-nm CMOS SOI
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We3D-2: A Simple Closed-Form CAD Approach for Sensitivity Analysis and Optimization of Passive Networks Against Load Variations
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We3G-3: A 60GHz Super Harmonic Injection Locked Oscillator with Quadrature Outputs
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We3H-4: A Sub-6GHz Ultra-Compact 69.8% Drain Efficiency Harmonic Control Doherty Power Amplifier in GaN Technology
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IF1-5: Metasurface Design for RCS Reduction Applications
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IF1-11: Tensor Train Optimization for Polynomial Chaos for High Dimensional Uncertainty Quantification
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IF1-18: A High-Efficiency Outphasing Power Amplifier Utilizing a Synthesized Direct-Matching Technique Based on Two-Section Branch-Line Coupler Output Combiner
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IF1-22: Ultra-Wideband 6-Bit Passive Phase Shifter with Open-Circuit Microstrip Pseudo-π Network and Low RMS Phase Error
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IF1-28: High Power-Added-Efficiency AlGaN/GaN E-Mode HEMTs for Low-Supply-Voltage RF Terminal Applications
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IF1-32: S-Parameter-Based Simulation Technique and Crosstalk Suppression for Large-Scale Superconducting Quantum-Computing Chip Design
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IF1-38: Fast-Switchable 3.6GHz GaN Doherty Power Amplifier for Energy-Efficient Non-Continuous Transmission of 256-QAM Signals
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IF1-44: A 30-mW D-Band High-Sensitivity Self-Injection-Locked Radar Sensor with Integrated SIW Antenna in 70-nm GaAs pHEMT Technology
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Th1A-2: Empty-SIW (eSIW) Based Beamformer System on Glass Package for G-Band Phased Array Applications
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Th1B-1: Edge Coupled DC–60GHz Different SPDT MEMS Switch for High-Speed Digital Applications
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Th1C-2: A Compact Millimeter-Wave Phase Shifter Integrated Variable Coupler in SIW Technology for Beam-Forming Applications
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Th1D-4: Dielectric Measurements of Conventional and 3-D Printed Substrate Materials from 50GHz to 1.5THz Using Free-Space and TDS Methods
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Th1F-3: A Compact Wideband Low-Loss On-Chip Power Combiner for High-Efficiency GaN mm-Wave Power Amplifiers
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Th1G-4: A >22GS/s, 44dB SNDR Wideband 4×4 Time-Interleaved Sampling Front-End with Bulk-Driven Mismatch Calibration in 22nm FDSOI
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Th2A-2: 3DGS 3D Heterogeneous Integrated RF Multi-Layers Glass-Interposer System-in-Package
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Th2B-3: Frequency and Bandwidth Design of Millimeter Wave Thin-Film Lithium Niobate Acoustic Filters
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Th2C-3: Novel Reflective-Type Bandpass Filter with Simultaneously Integrated Tunable Attenuation and Phase Shifting Functions
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Th2D-3: A Wideband Digital Compensation Model Based on Fast Bandwidth Sensing for Zero-IF Receiver
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Th2F-3: 300GHz 8×1 Active Phased Array MMIC with On-Chip Power Amplifiers, Vector Modulators, and Antennas
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Th2G-4: A 71–86-GHz Receiver with 5-GHz IF Signal Bandwidth for E-Band Broadband Communication in 65-nm CMOS
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Th3A-2: A Reconfigurable Dielectric-Loaded Millimeter-Wave Waveguide Bandpass Filter Based on Customized 3D-Printing Vanadium Dioxide Filament
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Th3A-5: Integration of Millimeter-Wave Air Filled Cavities and Filters Using Vertically Aligned Carbon Nanotubes
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Th3B-3: AlN/GaN MIS-HEMT With GeN Gate Dielectric for mm-Wave Applications
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Th3C-4: Spin Wave Fast Tunable (SWiFT) Filter
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Th3D-4: Differential-Mode Characterization of Multi-Port Passives up to 170GHz Using Independent Single-Ended Two-Port Measurements
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Th3F-4: Dall-EM: Generative AI with Diffusion Models for New Design Space Discovery and Target-to-Electromagnetic Structure Synthesis
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Th3G-3: Broadband LNA with Dual-Resonance Matching Network with Capacitive Feedback for Improved Gain and Noise Figure Using 0.1-µm GaAs pHEMT Technology
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WSG-1: Ku- and Ka-Band Beamformer with Antenna Arrays
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WSH-1: The Defense Advanced Research Projects Agency’s (DARPA) Next Generation Microelectronics Manufacturing (NGMM) Program
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WSL-5: Design Methodology for Sub-THz Power Amplifier and its Application to 6G D-Band in Advanced CMOS and BiCMOS Technologies
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WSI-3: Integrated Self-Interference Cancellers at RF for Communication and Radar
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WSO-10: Engineering Quantum Computers for the FTQC Era: A Little About a Lot!
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WSJ-7: A Fully Integrated Power Amplifier Module with Bias Controller to Tackle 5G mMIMO Basestation Applications at 3.5GHz
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WSC-4: AI-Enabled Discovery of New RF/mm-Wave Architectures and Synthesis of End-to-End RFICs
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WSK-5: Antennas and Packaging for a Sub-THz Wireless Point-to-Multipoint Link
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WSQ-4: Automation in the Design Workflow
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WMI-5: Solution of Sparse Matrix Equations Using HHL Algorithm with Quantum Walk Unitary Operator
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WME-8: Innovative Waveguide and 3D Tunable Filters
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WML-4: Fundamentals of Ray Tracing
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WMK-3: The Role and Challenges of Ultra-Wide Bandgap Semiconductors in Next-Generation GaN HEMTs
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WMM-1: Workshop Introduction
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WMM-11: Component and System-level Approaches for Analog Interference Mitigation
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WMA-6: Diamond-Metal Composite Package for High-Power RF Device
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WMN-1: Microwave and mm-Wave Multifunction Filtering Circuits Using Three-Dimensional High-Integration Technology
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WMO-1: Workshop Overview
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WPTB1-5: High Power/Energy Wireless power Beaming components and Systems
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Microwave Week 2020 Dashboard

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