Microwave Week 2020 Dashboard

Technical Session Audience Rating IMS

Displaying 1501 - 1550 of 2759
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  • We3D-3: Frequency-Query Enhanced Electromagnetic Surrogate Modeling with Edge Anti-Aliasing Pixelation for Bandpass Filter Inverse Design
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  • We3G-4: Low-Power and Low-Phase Noise 94-GHz and 107.2-GHz Differential Fundamental Oscillators in 70-nm GaAs pHEMT Technology
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  • We3H-5: A Ka-Band GaN Doherty Power Amplifier with High Efficiency Over a Fractional Bandwidth of 20.4%
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  • IF1-6: USB Type-C Receptacle Connector with Ceramic Insulator and Three-Layer Ground Plates
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  • IF1-12: Detection Algorithm for Waveguide Connection and Probe Contact States Based on Machine Learning in Frequency up to 1.1THz
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  • IF1-19: Accurate Large-Scale Motion Sensing With FMCW Radar Based on Range-Dependent DFT Technique
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  • IF1-23: A 28nm CMOS Almost All-Digital 0.5 to 4.0GHz Ultra-Wideband Ground Penetrating Radar for Lunar Surface Exploration
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  • IF1-28: High Power-Added-Efficiency AlGaN/GaN E-Mode HEMTs for Low-Supply-Voltage RF Terminal Applications
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  • IF1-34: A SiGe J-Band Gilbert Cell-Based Frequency Doubler and Power Amplifier Chain with 10dBm Output Power
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  • IF1-39: Predicting the Fidelity of Multiplexed Superconducting Qubit Readout with Multiphysics Numerical Methods
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  • IF1-45: Direction Finding for Software Defined Radios with Switched Uniform Circular Arrays
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  • Th1A-3: Evaluation of Stacked Structure for 160GHz End-Fire Type Compact Antenna-in-Package Considering Thermal Design
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  • Th1B-2: A Low-Loss, Wideband, 0–110GHz SPDT Using PCM RF Switches with Integrated CMOS Drivers
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  • Th1C-3: Ka-Band AFSIW Circuit-on-Substrate for Satellite Applications
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  • Th1D-4: Dielectric Measurements of Conventional and 3-D Printed Substrate Materials from 50GHz to 1.5THz Using Free-Space and TDS Methods
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  • Th1G-1: Broadband and Power-Efficient Optoelectronic Transmitter Monolithically Integrated in a SiGe BiCMOS ePIC Technology
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  • Th1G-5: A 0.9pJ/Bit 56Gb/s High-Swing Tri-Mode Wireline Transmitter with 6-Bit DAC Controlled Tailless-CML Driver and Impedance Calibration Loop
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  • Th2A-3: High Performance Waveguide Launcher in Interposer Package Technology for 77/79GHz Automotive 4D Imaging Radar
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  • Th2B-3: Frequency and Bandwidth Design of Millimeter Wave Thin-Film Lithium Niobate Acoustic Filters
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  • Th2C-3: Novel Reflective-Type Bandpass Filter with Simultaneously Integrated Tunable Attenuation and Phase Shifting Functions
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  • Th2D-4: Cross-Spectrum Phase Noise Measurements of 10-15-Level Stability Photonic Microwave Oscillators
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  • Th2F-4: 208GHz InP Distributed Amplifier with Combining Loss Reduction Techniques
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  • Th2G-4: A 71–86-GHz Receiver with 5-GHz IF Signal Bandwidth for E-Band Broadband Communication in 65-nm CMOS
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  • Th3A-2: A Reconfigurable Dielectric-Loaded Millimeter-Wave Waveguide Bandpass Filter Based on Customized 3D-Printing Vanadium Dioxide Filament
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  • Th3B-1: Deep Level Effects and Hot-Electron Reliability in Scaled GaN HEMTs
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  • Th3B-4: Influence of Double-Deck T-Gate Structures on Cut-Off Frequency in Al0.3Ga0.7N/AlN/GaN HEMTs
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  • Th3C-5: An Electrical Balance Duplexer Architecture without Inherent Insertion Loss Limitation
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  • Th3D-5: Cryogenic Microwave Probe Technology with High Thermal Insulation
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  • Th3F-4: Dall-EM: Generative AI with Diffusion Models for New Design Space Discovery and Target-to-Electromagnetic Structure Synthesis
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  • Th3G-4: A 140 GHz Low-Noise Amplifier in 45 nm RFSOI Based on a Joint-Noise-and-Gain-Optimized Embedding Network
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  • WSD-3: Design Methodologies for Low-Power Frequency Synthesizers
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  • WSG-4: Building Large-Volume SATCOM Phased Arrays Using Silicon
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  • WSH-2: 3D Heterogenous Integration (3DHI) for Advanced Communications
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  • WSL-5: Design Methodology for Sub-THz Power Amplifier and its Application to 6G D-Band in Advanced CMOS and BiCMOS Technologies
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  • WSI-4: Self-Interference Cancellation Techniques in Frequency Division Duplexing Receiver Front-Ends
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  • WSO-10: Engineering Quantum Computers for the FTQC Era: A Little About a Lot!
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  • WSN-5: Interconnect and Control Challenges in Silicon Spin Qubit Quantum Computers
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  • WSF-4: Vision on Phased Arrays Using Meta-Surfaces and on the Implementation of LO Phase Shifting Based on ILOs
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  • WSB-4: Sensing with mm-Wave 5G: Extracting Spatial Information Leveraging Directional Beams
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  • QUB1-1: Introduction to Quantum Computing: Qubits, Gates, and Algorithms
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  • WSR-3: Combined System of Wireless Power Transfer and Communication
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  • WMI-8: Rydberg Atom-Based E-Field Sensors and Receivers
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  • WMG-5: GaN-Si-Based RF Switch to Improve SWaP and Reduce Complexity Out of High-Power Radio Design
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  • WML-9: Controlled Accuracy Direct H2-Matrix Arithmetic for Fast and Large-Scale Solutions of Maxwell’s Equations
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  • WMK-5: Material and Device Engineering for High-Performance AlGaN RF Electronics
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  • WMM-6: Adaptive RF Front-Ends as a Key Enabler of Modern Communication Systems
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  • WMF-4: Optimizing Calibration Process and Reducing Measurement Uncertainties in Wafer-Level mm-Wave Range Characterization
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  • WMJ-4: Ultra-Low-Power, Long-Range Trackers Enabled by mm-Wave Backscatter and Radar Principles
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  • WMN-5: Realization of Passive Microwave Components Exploiting Available 3D Flexibility
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  • WMO-4: Radars, Digital Twins, and the Future: The Unseen Heroes of Tomorrow’s Technology
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