Microwave Week 2020 Dashboard

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Displaying 1951 - 2000 of 2742

IF1-7: A TSPC mm-Wave Frequency Divider with up to 50GHz Input Frequency in 12nm FinFET Bulk CMOS
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IF1-14: New Coaxial Interconnection — Application to Wilkinson Dividers/Combiners
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IF1-20: A THz Attenuator Based on Voltage-Tunable Whispering Gallery Mode Resonator
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IF1-24: Parallel Differential-Line Fed Planar Aperture Antenna-in-Package with Signal Lines Isolated from IC in 300-GHz Band
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IF1-29: GaN Trap Model Extraction Based on MHz Load-Line Measurements
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IF1-35: An Effective Basis Function Generation Structure for Digital Pre-Distortion in Wideband Scenarios
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IF1-43: A Compact Brick-Type 40GHz-Band DBF Transmit Antenna Module Using Direct Digital RF Technology
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Th1A-1: A D-Band Tx FOWLP Module with Silicon-Based Resonator Antenna Array
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Th1A-4: A Wideband W-Band Slotted Over-Mode Cavity Array with Dumbbell-Shaped Holey-EBG Units Based on Metallic Silicon-Based Process
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Th1B-5: A Microwave Acoustic QPSK Modulator Leveraging Poled Ferroelectrics
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Th1D-2: A Microwave Plasma Jet Array Based on SIW-Enabled Evanescent-Mode Cavity Resonator Technology
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Th1F-2: E-Band Power Amplifier with 32.2dBm Psat, 31.3dBm OP1dB Utilizing Commercial 0.10-µm GaAs pHEMT Technology
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Th1G-3: A 132GHz SiGe BiCMOS Sampler for Linear Front-Ends
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Th2A-1: Novel Low-Loss Shielded Interconnects for D-band/sub-THz Applications Using Microscale Metal Printing Technologies
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Th2B-1: KEYNOTE: The Unexpected Technology Race Between Surface (SAW) and Bulk (BAW) Acoustic Wave Filters in Today’s Cell Phones
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Th2C-1: A Reconfigurable Filtering Circulator/Isolator with Continuously Controllable Center Frequency and Insertion Phase
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Th2D-2: Millimeter-Wave Wideband Active Load-Pull System Using Vector Network Analyzer Frequency Extenders
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Th2F-2: 300-GHz-Band InP HBT Power Amplifier Module Enabling 280-Gbps 0-dBm Signal Generation with Digital Predistortion
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Th2G-2: A 130GHz 360° Gain-Invariant Phase Shifter with 5.625° Phase Resolution, 0.19° RMS Phase Error and < 0.56dB RMS Gain Error
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Th2G-6: First Demonstration of MMIC Low-Noise Amplifiers Operating at Ka-Band Realized with Enhancement-Mode Gallium Nitride HEMTs
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Th3A-5: Integration of Millimeter-Wave Air Filled Cavities and Filters Using Vertically Aligned Carbon Nanotubes
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Th3B-3: AlN/GaN MIS-HEMT With GeN Gate Dielectric for mm-Wave Applications
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Th3C-2: Tunable Dual-Band Coaxial Filter with Independent Band Control Using a Single Tuning Element Per Band
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Th3D-3: Characterization Approaches to Reduce Process Variation Dependencies for On-Wafer Power Calibration Transfer Devices in Bi/CMOS Technologies
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Th3F-3: AI-Assisted Template-Seeded Pixelated Design for Multi-Metal-Layer High-Coupling EM Structures: A Ku-Band 6G FR3 PA in 22nm FDX+
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Th3G-2: An 8–12.2GHz CMOS Low-Noise Amplifier with Partially Tail-Coupled Transformer and Large-Transistor Achieving 1.8dB Average NF
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WSD-8: Living Networks: Bioelectronic IoT and the Future of Secure, Energy-Efficient Wireless Systems
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WSG-9: Bringing Commercial Cellular Access to Space
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WSH-7: Advances in Wafer-Level Packaging (WLP) and Heterogeneous Integration for mm-Wave Phased Arrays
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WSL-5: mm-Wave High Efficiency, High Linearity GaN HEMT, GaAs and InP HBT Power Amplifiers
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WSI-9: Intelligent Self-Interference Mitigation for Integrated Radios
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WSN-5: Interconnect and Control Challenges in Silicon Spin Qubit Quantum Computers
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WSF-4: Vision on Phased Arrays Using Meta-Surfaces and on the Implementation of LO Phase Shifting Based on ILOs
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WSB-4: Sensing with mm-Wave 5G: Extracting Spatial Information Leveraging Directional Beams
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QUB1-2: Microwave Engineering of Quantum Computers
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AIB1-1: AI and Machine Learning for Microwave Design - An Introduction
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WMI-9: Design and Simulation of Waveguide-Based Devices in 2D Dirac Materials
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WMG-6: Innovations in GaN-on-Silicon Technology for High Performance Power and RF Applications
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WML-10: Butterfly Matrices and Tensors: New Tools for High-Frequency Integral and Differential Equation Solvers, and High-Dimensional Transforms
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WMK-6: Ga₂O₃ FETs for Future Power and Harsh Environment Electronics
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WMM-6: Adaptive RF Front-Ends as a Key Enabler of Modern Communication Systems
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WMF-6: On-Wafer 4-Port Measurements from 70kHz to 220GHz in a Single Sweep
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WMJ-6: Leveraging Radio Astronomy Techniques for Enhanced RF and Microwave Sensing
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WMN-7: Multilayered Wearable Ultrasound Technology
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WMO-6: Radar Applications in Mobile Phones for Ambient Awareness and Health Sensing
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RFB1-6: Design, Modeling and Operation of Antennas, Arrays and Metasurfaces in mmWave and THz Communications
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WMQ-2: Characterizing Low-Frequency Memory Effects using RF Real-Time NVNA Measurements
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Tu1A-2: A D-Band 1Tx 4Rx Mid-Range Automotive CMOS FMCW Radar
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Tu1B-2: A V-Band OOK Transmitter with 14.5Gbps Data Rate and 11.1% DC-to-RF Efficiency in 65nm CMOS
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Tu1C-3: Multi-Channel Integrated Microwave Photonic Transmitter for Radio-over-Fiber Systems
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Microwave Week 2020 Dashboard

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